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APL5537
Dual Channel 300mA Low Dropout Linear Regulator Features
* * * * * * * * * * *
Dual Regulator Outputs Low Dropout Voltage: Typical 240mV at 300mA Wide Input Voltage Range: 2.5V to 5.5V Low Quiescent Current: Typical 58A High PSRR: 70dB at 1kHz Low Shutdown Current: <1A Shutdown Function Output Current-Limit Protection Short-Circuit Current-Limit Protection Over-Temperature Protection Lead Free and Green Devices Available (RoHS Compliant)
General Description
The APL5537 is a dual channel low dropout linear regulator, which operates from 2.5V to 5.5V input voltage and delivers up to 300mA output current at each channel. Typical dropout voltage is only 240mV at 300mA. The APL5537 with low quiescent current, high PSRR, and low noise is ideal for battery powered system appliances. Other features include logic-controlled shutdown mode, over-temperature protection, short-circuit current-limit, and current-limit protection to ensure specified output current. The APL5537 is available in the TSOT-23-6A and TDFN 1.6x1.6-6 packages.
Pin Configurations
VOUT2 1 GND 2 EN2 3 6 VOUT1 5 VIN 4 EN1
Applications
* * *
Mobile Phone GPS Navigation Blue Tooth Headset
VIN 1 EN1 2 EN2 3
EP
6 VOUT1 5 VOUT2 4 GND
TSOT-23-6A (Top View)
TDFN1.6x1.6-6 (Top View)
Ordering and Marking Information
APL5537 Assembly Material Handling Code Temperature Range Package Code Voltage Code
Voltage Code See Voltage Code Table Package Code CT : TSOT-23-6A QB : TDFN1.6x1.6-6 Operating Ambient Temperature Range I : -40 to 85oC Handling Code TR : Tape & Reel Assembly Material G : Halogen and Lead Free Device
APL5537-VVCT: APL5537-VVQB:
7VVX 7VV X
VV - Voltage Code X - Date Code VV - Voltage Code X - Date Code
Note : ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for MSL classification at lead-free peak reflow temperature. ANPEC defines "Green" to mean lead-free (RoHS compliant)and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight). ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright (c) ANPEC Electronics Corp. Rev. A.5 - Oct., 2009 1 www.anpec.com.tw
APL5537
Voltage Code Table
Output Voltage VOUT1 (V) 1.30 1.85 1.50 1.80 2.50 2.50 2.80 2.85 2.80 2.80 2.80 3.30 3.30 3.15 VOUT2 (V) 2.80 1.85 1.50 1.20 1.80 3.00 2.85 2.85 1.80 3.30 3.00 2.85 3.30 2.80 7M bb 99 C5 JC JO Ud dd MC MR MO Rd RR eM Voltage Code 1.20 1.85 1.50 1.80 1.80 2.50 2.50 2.85 2.85 2.80 3.00 3.00 3.30 3.30 Output Voltage VOUT1 (V) VOUT2 (V) 2.80 1.50 2.80 2.60 3.30 2.80 3.30 1.85 1.80 2.80 1.80 3.00 3.00 3.10 5M b9 9M CK CR JM JR db dC MM OC OO RO RP Voltage Code
Available Voltage Version
Code Voltage Code Voltage 5 1.20 c 2.65 7 1.30 L 2.70 9 1.50 M 2.80 A 1.60 d 2.85 C 1.80 N 2.90 b 1.85 O 3.00 D 1.90 P 3.10 E 2.00 e 3.15 F 2.10 Q 3.20 J 2.50 R 3.30 K 2.60
Absolute Maximum Ratings
Symbol VIN VEN1, VEN2 TJ TSTG TSDR VIN Input Voltage (VIN to GND) EN1, EN2 to GND Voltage Maximum Junction Temperature Storage Temperature
(Note 1)
Rating -0.3 ~ 7 -0.3 ~ 7 150 -65 ~ 150 260 Unit V V
o o o
Parameter
C C C
Maximum Lead Soldering Temperature, 10 Seconds
Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Thermal Characteristics
Symbol JA Parameter Junction-to-Ambient Resistance in Free Air (Note 2) TSOT-23-6A TDFN1.6x1.6-6 220 165
o
Typical Value
Unit C/W
Note 2: JA is measured with the component mounted on a high effective thermal conductivity test board in free air.
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APL5537
Recommended Operating Conditions
Symbol VIN VEN1, VEN2 IOUT TA TJ VIN Input Voltage (VIN to GND) EN1, EN2 to GND Voltage VOUT Output Current Ambient Temperature Junction Temperature Parameter
(Note 3)
Range 2.5 ~ 5.5 0 ~ 5.5 0 ~ 300 -40 ~ 85 -40 ~ 125 Unit V V mA
o o
C C
Note 3: Refer to the typical application circuit
Electrical Characteristics
Unless otherwise specified, these specifications apply over VIN=VOUT+1V, VEN1= VEN2=5V and TA= -40 to 85 oC. Typical values are at TA=25oC. Symbol Parameter Test Conditions Min. UNDER-VOLTAGE LOCKOUT (UVLO) AND SUPPLY CURRENT VIN UVLO Threshold Voltage VIN UVLO Hysteresis IQ VIN Supply Current No load, VEN1= VEN2=5V No load, VEN1= VEN2=0V IOUT=1mA, TA= 25 oC IOUT=1mA to 300mA, TA= -40 C to 85 C Line Regulation Load Regulation VDROP Dropout Voltage (Note 4) IOUT=1mA, VIN=VOUT+0.3V to 5.5V, or VIN=2.5V to 5.5V IOUT=1mA to 300mA IOUT=300mA f=100Hz PSRR Power Supply Rejection Ratio f=1kHz IOUT=50mA, COUT=2.2F f=10kHz f=100kHz Output Noise VOUT Discharge Resistance ENABLE/DISABLE (EN1 AND EN2) VIH VIL EN Input Logic HIGH EN Input Logic LOW EN Input Current VIN=2.5V to 5.5V VIN=2.5V to 5.5V VEN1= VEN2=5V 1.5 0.2 0.4 V V A IOUT=1mA, BW=10 to 100kHz, COUT=10F VEN1= VEN2=0V
o o
APL5537 Typ. Max.
Unit
VIN rising, TA= -40 to 85 oC
1.9 -
2.2 0.1 58 -
2.45 90 1
V V A A
OUTPUT VOLTAGE (REGULATOR1 AND REGULATOR2) Output Voltage Accuracy -1 -3 240 70 70 60 35 100 0.7 +1 +3 0.2 0.6 330 VRMS k dB % % %/V % mV
PROTECTIONS (REGULATOR1 AND REGULATOR2) ILIMIT ISHORT Current Limit Threshold Short-Circuit Output Current Over-Temperature Threshold Over-Temperature Hysteresis Soft-Start Time 330 450 50 160 40 60 750 mA mA C C s
Note 4: The dropout voltage is defined as VIN - VOUT, when VOUT is 100mV below the value of VOUT for VIN = VOUT + 1V. Copyright (c) ANPEC Electronics Corp. Rev. A.5 - Oct., 2009 3 www.anpec.com.tw
APL5537
Typical Operating Characteristics
Output Voltage vs. Temperature
3.10 APL5537-OC VOUT1 Output Voltage (V)
Output Voltage (V) 1.90 APL5537-OC VOUT2 1.85
Output Voltage vs. Temperature
3.05
3.00
1.80
2.95
1.75
2.90 -40 -25
1.70
0
25
50
75 (oC)
100
125
-40 -25
0
25
50
75 ( oC)
100
125
Temperature
Temperature
Quiescent Current vs. Temperature
65 APL5537-OC VIN=VEN=4.2V Quiescent Current (A) 60
Dropout Voltage (mV) 350 300 250 200 150 100 50
Dropout Voltage vs. Output Current
TJ=125oC
TJ=25oC
55
TJ=-40oC
50
45 -40 -25
0
25
50
75
100
125
0
0
50
100
150
200
250
300
Temperature (oC)
Output Current (mA)
PSRR vs. Frequency
0
IOUT1=50mA
Noise
200 150 100 Noise (V) 50 0 -50 -100 IOUT=50mA VIN=VEN=4.2V (Battery)
-20 PSRR (dB)
-40
-60
-80
-150
-100 100 1k 10k Frequency (Hz) 100k 1M
-200
0
20m
40m
60m
80m
100m
Time (sec)
Copyright (c) ANPEC Electronics Corp. Rev. A.5 - Oct., 2009
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APL5537
Operating Waveforms
Refer to the typical application circuit. The test condition is VIN=VEN=4.2V, TA= 25oC. Unless otherwise specified.
Power on
Power off
VIN
1
1
VIN
VOUT1
2
2
VOUT1
VOUT2
3
3
VOUT2
CIN=COUT=1F, IOUT1=IOUT2=10mA CH1: VIN, 2V/Div, DC CH2: VOUT1, 1V/Div, DC CH3: VOUT2, 1V/Div, DC TIME: 4ms/Div
CIN=COUT=1F, IOUT1=IOUT2=10mA CH1: VIN, 2V/Div, DC CH2: VOUT1, 1V/Div, DC CH3: VOUT2, 1V/Div, DC TIME: 4ms/Div
Enable Response
Disable Response
VEN
1
VEN
1
VOUT1
2
VOUT1
2
3
VOUT2
3
VOUT2
CIN=COUT=1F, IOUT1=IOUT2=10mA CH1: VEN, 5V/Div, DC CH2: VOUT1, 1V/Div, DC CH3: VOUT2, 1V/Div, DC TIME: 40s/Div
CIN=COUT=1F, IOUT1=IOUT2=50mA CH1: VEN, 5V/Div, DC CH2: VOUT1, 1V/Div, DC CH3: VOUT2, 1V/Div, DC TIME: 40s/Div
Copyright (c) ANPEC Electronics Corp. Rev. A.5 - Oct., 2009
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APL5537
Operating Waveforms (Cont.)
Refer to the typical application circuit. The test condition is VIN=VEN=4.2V, TA= 25oC. Unless otherwise specified.
Line Transient Response
Line Transient Response
VIN
1 2 1
VIN VOUT1
VOUT1
2
3
VOUT2
VOUT2
3
VIN=3.8V to 4.8V to 3.8V (rise / fall time = 4s) CIN=COUT=1F, IOUT1=IOUT2=10mA CH1: VIN, 500mV/Div, DC, Offset=3.8V CH2: VOUT1, 20mV/Div, DC, Offset=3.0V CH3: VOUT2, 20mV/Div, DC, Offset=1.8V TIME:100s/Div
VIN=3.8V to 4.8V to 3.8V (rise / fall time = 4s) CIN=COUT=1F, IOUT1=IOUT2=50mA CH1: VIN, 500mV/Div, DC, Offset=3.8V CH2: VOUT1, 20mV/Div, DC, Offset=3.0V CH3: VOUT2, 20mV/Div, DC, Offset=1.8V TIME:100s/Div
Line Transient Response
Load Transient Response
VIN
1 2
1
I OUT VOUT1
2
VOUT1
3
VOUT2
VOUT2
3
VIN=3.8V to 4.8V to 3.8V (rise / fall time = 4s) CIN=COUT=1F, IOUT1=IOUT2=100mA CH1: VIN, 500mV/Div, DC, Offset=3.8V CH2: VOUT1, 20mV/Div, DC, Offset=3.0V CH3: VOUT2, 20mV/Div, DC, Offset=1.8V TIME:100s/Div
IOUT=10mA to 50mA to 10mA (rise / fall time = 1s) CIN=COUT=1F, VIN=VEN=4.2V CH1: IOUT, 50mA/Div, DC CH2: VOUT1, 20mV/Div, DC, Offset=3.0V CH3: VOUT2, 20mV/Div, DC, Offset=1.8V TIME:40s/Div
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APL5537
Operating Waveforms (Cont.)
Refer to the typical application circuit. The test condition is VIN=VEN=4.2V, TA= 25oC. Unless otherwise specified.
Load Transient Response
Load Transient Response
I OUT
1 1
IOUT VOUT1
2
VOUT1
2
VOUT2
3 3
VOUT2
IOUT=10mA to 100mA to 10mA (rise / fall time = 1s) CIN=COUT=1F, VIN=VEN=4.2V CH1: IOUT, 50mA/Div, DC CH2: VOUT1, 20mV/Div, DC, Offset=3.0V CH3: VOUT2, 20mV/Div, DC, Offset=1.8V TIME:40s/Div
IOUT=10mA to 200mA to 10mA (rise / fall time = 1s) CIN=COUT=1F, VIN=VEN=4.2V CH1: IOUT, 100mA/Div, DC CH2: VOUT1, 50mV/Div, DC, Offset=3.0V CH3: VOUT2, 50mV/Div, DC, Offset=1.8V TIME:40s/Div
Pin Description
PIN NO. TSOT-23-6A TDFN1.6x1.6-6 5 4 3 2 1 6 1 2 3 4 5 6 VIN EN1 EN2 GND VOUT2 VOUT1 EP Input Supply Pin. VIN can range from 2.5V to 5.5V and should be bypassed with at least a 1F capacitor. Enable Input. Pulling the VEN1/2 above 1.5V enables the respective regulator output; pulling VEN1/2 below 0.4V disables the respective regulator output. Ground. Regulator Outputs. Sources up to 300mA. Bypass with at least a 1F capacitor to the GND respectively. Exposed Pad. Connect it to a large ground plane for heatsinking. FUNCTION NAME
Copyright (c) ANPEC Electronics Corp. Rev. A.5 - Oct., 2009
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APL5537
Block Diagram
VIN
Current Limit1
EN1
UVLO and Shutdown Control1 VREF1 OverTemperature Protection Short Circuit Current Limit1
VOUT1
GND
EN2
UVLO and Shutdown Control2 VREF2 OverTemperature Protection
Current Limit2
VOUT2
Short Circuit Current Limit2
Typical Application Circuit
VIN 2.5V to 5.5V VOUT1 COUT1 1F 1.2V to 3.3V/300mA
VIN CIN 1F
VOUT1
APL5537
ON OFF EN1 EN2 GND VOUT2 COUT2 1F VOUT2 1.2V to 3.3V/300mA
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APL5537
Function Description
VIN Under-Voltage Lockout (UVLO) The APL5537 has a built-in under-voltage lockout circuit to keep the outputs shuting off until internal circuitry is operating properly. The UVLO circuit has a hysteresis and a de-glitch feature so that it will typically ignore undershoot transients on the input. Soft-Start (For Each Channel) The APL5537 provides an internal soft-start circuitry to control rise rate of the output voltage and limit the current surge during start-up. The output voltage starts the softstart at approximate 60s after the VIN is over the UVLO threshold. The typical soft-start interval is about 60s. Current-Limit Protection (For Each Channel) The APL5537 provides a current-limit protection function. During current limit, the device limits output current at current limit threshold. For reliable operation, the device should not be operated in current limit for extended period. Short-Circuit Current-Limit Protection (For Each Channel) When the output voltage drops below 0.8V, which is caused by the over load or short circuit, the device limits the output current down to a safe level. The short circuit current limit is used to reduce the power dissipation during short circuit conditions. If the junction temperature is over the over-temperature threshold, the device will enter the thermal shutdown. Enable/Disable (For Each Channel) Pulling the VEN1/2 above 1.5V enables the respective LDO output, and pulling VEN1/2 below 0.4V disables the respective LDO output. When both the LDO outputs are disabled, the supply current is reduced to less than 1A. EN1/2 pins are internally pulled low by resistors. If shutdown function is not used, connect EN1/2 to VIN for normal operation. The enable inputs are compatible with both TTL and CMOS logic levels. Over-Temperature Protection An over-temperature protection circuitry limits the junction temperature of APL5537. When the junction temperature exceeds +160 oC, the over-temperature protection circuitry disables the LDO outputs, allowing the device to cool down. The LDO outputs are enabled again after the junction temperature cools down by 40oC, resulting in a pulsed output during continuous thermal overload conditions. Over-temperature protection is designed to protect the IC in the event of over temperature conditions. For reliable operation, the junction temperature cannot exceed TJ=+125oC
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APL5537
Application Information
Input Capacitor The APL5537 requires proper input capacitors to supply surge current during stepping load transients to prevent the input rail from dropping. Because the parasitic inductor from the voltage sources or other bulk capacitors to the VIN limit the slew rate of the surge current, place the Input capacitors near VIN as close as possible. Input capacitors should be larger than 1F and a minimum ceramic capacitor of 1F is necessary. Output Capacitor The APL5537 needs a proper output capacitor to maintain circuit stability and improve transient response over temperature and current. In order to insure the circuit stability, the proper output capacitor value should be larger than 1F. With X5R and X7R dielectrics, 1F is sufficient at all operating temperatures. Large output capacitor value can reduce noise and improve load-transient response and PSRR, Figure 1. shows the curves of allowable ESR range as the function of load current for various output capacitor values. where (TJ-TA) is the temperature difference between the junction and ambient air. JA is the thermal resistance between Junction and ambient air. Assuming the TA=25oC and maximum TJ=160oC (typical thermal limit threshold), the maximum power dissipation is calculated as: PD(max)=(160-25)/165 = 0.82(W) For normal operation, do not exceed the maximum junction temperature rating of TJ = 125 oC. The calculated power dissipation should be less than: PD =(125-25)/165 = 0.61(W) The GND provides an electrical connection to the ground and channels heat away. Connect the GND to the ground by using a large pad or a ground plane. Layout Consideration Figure 2 illustrates the layout. Below is a checklist for your layout: 1. Please place the input capacitors close to the VIN. 2. Ceramic capacitors for load must be placed near the load as close as possible. 3. To place APL5537 and output capacitors near the load is good for performance. 4. Large current paths, the bold lines in figure 2, must have wide tracks.
VIN VIN VOUT1 COUT1 CIN VOUT1
Region of Stable COUT ESR vs. Output Current
10 Region of Stable COUT ESR () APL5537-OC VIN=VEN=4.2V CIN=COUT=1F/X7R 1 Unstable Range
0.1
Stable Range
ON EN1 EN2
APL5537
VOUT2
VOUT2 COUT2
0.01
Stable by Simulation Verify
OFF
GND
0.001
0
50
100
150
200
250
300
Output Current (mA)
Figure2. Large Current Paths Figure1. Stable COUT ESR Range Operation Region and Power Dissipation The APL5537 maximum power dissipation depends on the thermal resistance and temperature difference between the die junction and ambient air. The TDFN1.6x 1.6-6 package power dissipation PD across the device is: PD = (TJ - TA) / JA
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APL5537
Package Information
TSOT-23-6A
D e
SEE VIEW A
E1 b e1
E
c
A2
A
0.25 GAUGE PLANE SEATING PLANE L VIEW A TSOT-23-6A INCHES MIN. 0.028 0.000 0.028 0.012 0.003 0.106 0.102 0.055 0.037 BSC 0.075 BSC 0.60 8 0.012 0 0.024 8 MAX. 0.039 0.004 0.035 0.020 0.008 0.122 0.118 0.071 MAX. 1.00 0.10 0.90 0.50 0.20 3.10 3.00 1.80
S Y M B O L A A1 A2 b c D E E1 e e1 L 0
MILLIMETERS MIN. 0.70 0.01 0.70 0.30 0.08 2.70 2.60 1.40 0.95 BSC 1.90 BSC 0.30 0
Note : Dimension D and E1 do not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side.
Copyright (c) ANPEC Electronics Corp. Rev. A.5 - Oct., 2009
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APL5537
Package Information (Cont.)
TDFN1.6x1.6-6
D A
Pin 1
E
D2 A3
Pin 1 Corner
e S Y M B O L A A1 A3 b D D2 E E2 e K L 0.20 0.19 0.20 1.55 0.95 1.55 0.55 0.50 BSC 0.29 0.008 0.007 TDFN1.6x1.6-6 MILLIMETERS MIN. 0.70 0.00 0.20 REF 0.30 1.65 1.05 1.65 0.65 0.008 0.061 0.037 0.061 0.022 0.020 BSC 0.011 MAX. 0.80 0.05 MIN. 0.028 0.000 0.008 REF 0.012 0.065 0.041 0.065 0.026 INCHES MAX. 0.031 0.002
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L
K
E2
b
A1
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APL5537
Carrier Tape & Reel Dimensions
OD0
P0
P2
P1
A E1 F
K0 B SECTION A-A
B0
A0
OD1 B
A
SECTION B-B
T
d
Application
A 178.0O .00 2
H 50 MIN. P1 4.0O .10 0 H 50 MIN. P1 4.0O .10 0
H A
T1
T1 8.4+2.00 -0.00 P2 2.0O .05 0 T1 12.4+2.00 -0.00 P2 2.0O .05 0
C 13.0+0.50 -0.20 D0 1.5+0.10 -0.00 C 13.0+0.50 -0.20 D0 1.5+0.10 -0.00
d 1.5 MIN. D1 1.0 MIN. d 1.5 MIN. D1 1.5 MIN.
D 20.2 MIN. T 0.6+0.00 -0.40 D 20.2 MIN. T 0.6+0.00 -0.40
W 8.0O .30 0 A0 3.20O .20 0 W 12.0O .30 0 A0 1.90O .20 0
E1 1.75O .10 0 B0 3.10O .20 0 E1 1.75O .10 0 B0 1.90O .20 0
W
F 3.5O .05 0 K0 1.50O .20 0 F 5.5O .05 0 K0 1.30O .20 0 (mm)
TSOT-23-6A
P0 4.0O .10 0
Application
A 178.0O .00 2
TDFN1.6x1.6-6
P0 4.0O .10 0
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APL5537
Devices Per Unit
Package Type TSOT-23-6A TDFN1.6x1.6-6 Unit Tape & Reel Tape & Reel Quantity 3000 3000
Taping Direction Information
TSOT-23-6A
USER DIRECTION OF FEED
AAAX
AAAX
AAAX
AAAX
AAAX
AAAX
AAAX
TDFN1.6x1.6-6
USER DIRECTION OF FEED
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APL5537
Classification Profile
Classification Reflow Profiles
Profile Feature Preheat & Soak Temperature min (Tsmin) Temperature max (Tsmax) Time (Tsmin to Tsmax) (ts) Average ramp-up rate (Tsmax to TP) Liquidous temperature (TL) Time at liquidous (tL) Peak package body Temperature (Tp)* Time (tP)** within 5C of the specified classification temperature (Tc) Average ramp-down rate (Tp to Tsmax) Time 25C to peak temperature Sn-Pb Eutectic Assembly 100 C 150 C 60-120 seconds 3 C/second max. 183 C 60-150 seconds See Classification Temp in table 1 20** seconds 6 C/second max. 6 minutes max. Pb-Free Assembly 150 C 200 C 60-120 seconds 3C/second max. 217 C 60-150 seconds See Classification Temp in table 2 30** seconds 6 C/second max. 8 minutes max.
* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
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APL5537
Classification Reflow Profiles (Cont.)
Table 1. SnPb Eutectic Process - Classification Temperatures (Tc) Package Thickness <2.5 mm 2.5 mm Package Thickness <1.6 mm 1.6 mm - 2.5 mm 2.5 mm Volume mm <350 260 C 260 C 250 C
3
Volume mm <350 235 C 220 C
3
Volume mm 350 220 C 220 C Volume mm 350-2000 260 C 250 C 245 C
3
3
Table 2. Pb-free Process - Classification Temperatures (Tc) Volume mm >2000 260 C 245 C 245 C
3
Reliability Test Program
Test item SOLDERABILITY HOLT PCT TCT HBM MM Latch-Up Method JESD-22, B102 JESD-22, A108 JESD-22, A102 JESD-22, A104 MIL-STD-883-3015.7 JESD-22, A115 JESD 78 Description 5 Sec, 245C 1000 Hrs, Bias @ 125C 168 Hrs, 100%RH, 2atm, 121C 500 Cycles, -65C~150C VHBMU2KV VMMU200V 10ms, 1trU 100mA
Customer Service
Anpec Electronics Corp. Head Office : No.6, Dusing 1st Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 2F, No. 11, Lane 218, Sec 2 Jhongsing Rd., Sindian City, Taipei County 23146, Taiwan Tel : 886-2-2910-3838 Fax : 886-2-2917-3838
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